A.G. Kunz, LLC | Mar 2018 - current

Hardware Engineer - device packaging for Quantum Computers. Typical package requirements include: 

• cryogenic thermalization

• light tightness

• superconductivity

• tight assembly tolerances (typically 0.100mm but some parts require measurements via interferometry)

Design Engineer - client facing role in model-based design management for data centers. Developed systems relating to:

• virtual project controls

• field integration and assembly

• capital expenditure

• modular product architecture

• lifecycle analysis

Additionally, performed product design and simulation. Improved prototype designs through parametric modeling and crafting high res renders. Simulations took the form of FEA, flow sims, and topology optimization. Kinematic simulations were utilized for verifying product features and coordinating space constraints for field installations.

Zodiac Pool Systems | Jun 2017 - Dec 2017

Aided Engineering lab test procedures through documentation and design of test fixtures. Produced wiring diagrams that orchestrated the production of large-scale systems integration projects. Created cost estimates for equipment to be utilized for various qualification tests. Detailed tracking of projects, and adherence to meeting goals and deadlines in a set schedule. Familiar with project documentation such as engineering change orders and redlining engineering schematics/drawings. 

1. Fundamental Awareness (Basic Knowledge)
2. Novice (Limited Experience)
3. Intermediate (Practical Knowledge)
4. Advanced (Applied Theory)
5. Expert (Recognized Authority)